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	Item #	IF(AV)	Package	VRRM	VFM	IFSM
	VS-100MT160P-P	100	MTP PressFit	1600	1.51	450
The new 100MT160P-P module is easy to use thanks to solderless method for contacting PressFit pins to the PCB. The low profile package has been specifically conceived to maximize space saving and optimize the electrical layout of the application specific power supplies. See the 100MT160P-P data sheet for more information. Data Sheet Collapse
	VS-70MT160P-P	75	MTP PressFit	1600	1.45	398
The new 70MT160P-P module is easy to use thanks to solder less method for contacting PressFit pins to the PCB. The low profile package has been specifically conceived to maximize space saving and optimize the electrical layout of the application specific power supplies. See the 70MT160P-P data sheet for more information. Data Sheet Collapse

VS-100MT160P-P