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Standard Engineered Heat Sinks · Natural Convection Models: Ideal for applications where forced-air cooling isn't an option. An engineered bonded fin heat sink from C & H Technology can be up to 50% smaller in size over a comparably performing extruded style heat sink.	Fan-Forced Air Convection Models: Single Fan Forced Air , Dual Fan Forced Air Convection , Triple Fan Forced Air Convection Increased thermal performance over natural convection models. Perfect for applications using high thermal density semiconductors, such as IGBTs and MOSFETs. Forced air and natural convection profiles are available in a variety of finishes. The ability to choose from various configurations enables the engineer to tailor the heat sink profile to meet specific thermal needs of the application.
Cool-Pak High Fin Density Heat Sinks: The high fin density of the Cool-Pak Series increases thermal performance giving the designer high cooling capacity in a small package.	CoolPlate Liquid Cooled Heat Sinks: 1 Pass, 2 Pass, 4 Pass, 6 Pass: Can handle extremely high heat concentrations with lower device temperature rise. These cold plates consist of either four or six pass square copper tubing imbedded within a precision-machined aluminum plate.
PowerPak Impingement Cooling: This series of heat sinks comes with a ball-bearing Muffin XLä fan. The impingement cooling allows high speed switching IGBT's and MOSFET modules to be mounted close together.	DC to DC Converter Designed specifically for high performance cooling of DC to DC power converter modules. Offered in three sizes—full brick, half brick, and quarter brick.